93LC66B-I/MNY
vs
93LC66BXT-E/OT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
SOT-23
Package Description
HVSON,
LSSOP,
Pin Count
8
6
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
2 MHz
2 MHz
JESD-30 Code
R-PDSO-N8
R-PDSO-G6
JESD-609 Code
e4
e3
Length
3 mm
2.9 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
8
6
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256X16
256X16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/Serial
SERIAL
SERIAL
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
0.8 mm
1.45 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Supply Current-Max
0.002 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Matte Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.95 mm
Terminal Position
DUAL
DUAL
Width
2 mm
1.55 mm
Write Cycle Time-Max (tWC)
6 ms
6 ms
Base Number Matches
1
2
Pbfree Code
Rohs Code
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Compare 93LC66B-I/MNY with alternatives
Compare 93LC66BXT-E/OT with alternatives