93LC66B/P
vs
93LC66BT-E/MNY
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIP
|
DFN
|
Package Description |
DIP, DIP8,.3
|
HVSON,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Factory Lead Time |
6 Weeks
|
7 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Clock Frequency-Max (fCLK) |
2 MHz
|
2 MHz
|
Data Retention Time-Min |
200
|
200
|
Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-N8
|
JESD-609 Code |
e3
|
e4
|
Length |
9.46 mm
|
3 mm
|
Memory Density |
4096 bit
|
4096 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
256 words
|
256 words
|
Number of Words Code |
256
|
256
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
256X16
|
256X16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
HVSON
|
Package Equivalence Code |
DIP8,.3
|
SOLCC8,.12,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Programming Voltage |
3 V
|
|
Qualification Status |
Not Qualified
|
|
Screening Level |
AEC-Q100
|
TS 16949
|
Seated Height-Max |
4.32 mm
|
0.8 mm
|
Serial Bus Type |
MICROWIRE
|
MICROWIRE
|
Standby Current-Max |
0.000001 A
|
0.000005 A
|
Supply Current-Max |
0.0015 mA
|
0.002 mA
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
2 mm
|
Write Cycle Time-Max (tWC) |
6 ms
|
6 ms
|
Write Protection |
HARDWARE/SOFTWARE
|
SOFTWARE
|
Base Number Matches |
1
|
1
|
Moisture Sensitivity Level |
|
1
|
Output Characteristics |
|
TOTEM POLE
|
Peak Reflow Temperature (Cel) |
|
260
|
Ready/Busy |
|
YES
|
Reverse Pinout |
|
NO
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Toggle Bit |
|
YES
|
|
|
|
Compare 93LC66B/P with alternatives
Compare 93LC66BT-E/MNY with alternatives