93LC66A-TE/STG
vs
CAT24WC66K-1.8TE13REV-C
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
CATALYST SEMICONDUCTOR INC
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8
|
EIAJ, SOIC-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
unknown
|
Clock Frequency-Max (fCLK) |
3 MHz
|
0.4 MHz
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e0
|
Length |
4.4 mm
|
5.3 mm
|
Memory Density |
4096 bit
|
65536 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
512 words
|
8192 words
|
Number of Words Code |
512
|
8000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512X8
|
8KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
2.03 mm
|
Serial Bus Type |
MICROWIRE
|
I2C
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
3 mm
|
5.25 mm
|
Write Cycle Time-Max (tWC) |
6 ms
|
10 ms
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 93LC66A-TE/STG with alternatives
Compare CAT24WC66K-1.8TE13REV-C with alternatives