93LC66A-TE/STG vs CAT24WC66K-1.8TE13REV-C feature comparison

93LC66A-TE/STG Microchip Technology Inc

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CAT24WC66K-1.8TE13REV-C Catalyst Semiconductor

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC CATALYST SEMICONDUCTOR INC
Part Package Code TSSOP SOIC
Package Description 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8 EIAJ, SOIC-8
Pin Count 8 8
Reach Compliance Code compliant unknown
Clock Frequency-Max (fCLK) 3 MHz 0.4 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e3 e0
Length 4.4 mm 5.3 mm
Memory Density 4096 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 512 words 8192 words
Number of Words Code 512 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512X8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 2.03 mm
Serial Bus Type MICROWIRE I2C
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2.5 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Width 3 mm 5.25 mm
Write Cycle Time-Max (tWC) 6 ms 10 ms
Base Number Matches 1 1

Compare 93LC66A-TE/STG with alternatives

Compare CAT24WC66K-1.8TE13REV-C with alternatives