93LC66A-I/P
vs
93LC66BT/P
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
|
Part Package Code |
DIP
|
|
Package Description |
DIP-8
|
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.51
|
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Additional Feature |
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
|
|
Clock Frequency-Max (fCLK) |
1 MHz
|
|
Data Retention Time-Min |
200
|
|
Endurance |
1000000 Write/Erase Cycles
|
|
JESD-30 Code |
R-PDIP-T8
|
|
JESD-609 Code |
e3
|
|
Length |
9.27 mm
|
|
Memory Density |
4096 bit
|
|
Memory IC Type |
EEPROM
|
|
Memory Width |
8
|
|
Number of Functions |
1
|
|
Number of Ports |
1
|
|
Number of Terminals |
8
|
|
Number of Words |
512 words
|
|
Number of Words Code |
512
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512X8
|
|
Output Characteristics |
TOTEM POLE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP8,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Parallel/Serial |
SERIAL
|
|
Qualification Status |
Not Qualified
|
|
Ready/Busy |
YES
|
|
Reverse Pinout |
NO
|
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
5.33 mm
|
|
Serial Bus Type |
MICROWIRE
|
|
Standby Current-Max |
0.000001 A
|
|
Supply Current-Max |
0.002 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
1.8 V
|
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Toggle Bit |
YES
|
|
Width |
7.62 mm
|
|
Write Cycle Time-Max (tWC) |
6 ms
|
|
Write Protection |
SOFTWARE
|
|
Base Number Matches |
1
|
|
|
|
|
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