93LC66-I/P
vs
93LC66BT/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
Package Description
DIP, DIP8,.3
Pin Count
8
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Factory Lead Time
6 Weeks
Date Of Intro
1991-01-01
Samacsys Manufacturer
Microchip
Alternate Memory Width
8
Clock Frequency-Max (fCLK)
2 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
JESD-609 Code
e3
Length
9.46 mm
Memory Density
4096 bit
Memory IC Type
EEPROM
Memory Width
16
Number of Functions
1
Number of Ports
1
Number of Terminals
8
Number of Words
256 words
Number of Words Code
256
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
256X16
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
SERIAL
Programming Voltage
3 V
Qualification Status
Not Qualified
Screening Level
TS 16949
Seated Height-Max
4.32 mm
Serial Bus Type
MICROWIRE
Standby Current-Max
0.0001 A
Supply Current-Max
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
Write Protection
SOFTWARE
Base Number Matches
1
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