93LC56AT-E/MC
vs
93LC56AX-E/MCG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
SON
Package Description
HVSON, SOLCC8,.11,20
HVSON,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
2 MHz
3 MHz
Data Retention Time-Min
200
200
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-XDSO-N8
JESD-609 Code
e3
e3
Length
3 mm
3 mm
Memory Density
2048 bit
2048 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256X8
256X8
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVSON
HVSON
Package Equivalence Code
SOLCC8,.11,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1 mm
1 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Standby Current-Max
0.000005 A
Supply Current-Max
0.002 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
2 mm
2 mm
Write Cycle Time-Max (tWC)
6 ms
6 ms
Write Protection
SOFTWARE
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 93LC56AT-E/MC with alternatives
Compare 93LC56AX-E/MCG with alternatives