93LC46AT-E/MSGX
vs
93LC46AT-I/MC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TSSOP,
HVSON, SOLCC8,.11,20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Clock Frequency-Max (fCLK)
3 MHz
3 MHz
JESD-30 Code
S-PDSO-G8
R-PDSO-N8
JESD-609 Code
e3
e3
Length
3 mm
3 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
128X8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVSON
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Supply Current-Max
0.002 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
3 mm
2 mm
Write Cycle Time-Max (tWC)
6 ms
6 ms
Base Number Matches
2
8
Pbfree Code
Part Package Code
DFN
Pin Count
8
Factory Lead Time
6 Weeks
Samacsys Manufacturer
Microchip
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
Number of Ports
1
Output Characteristics
TOTEM POLE
Package Equivalence Code
SOLCC8,.11,20
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Reverse Pinout
NO
Screening Level
TS 16949
Standby Current-Max
0.000001 A
Time@Peak Reflow Temperature-Max (s)
40
Write Protection
SOFTWARE
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