93L425ADC
vs
AM10415AFMB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DFP
Package Description
DIP, DIP16,.3
DFP, FL16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-GDIP-T16
R-GDFP-F16
JESD-609 Code
e0
e0
Length
19.43 mm
10.16 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
16
16
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1KX1
1KX1
Output Characteristics
3-STATE
OPEN-EMITTER
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Equivalence Code
DIP16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2.159 mm
Supply Current-Max
0.065 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
YES
Technology
TTL
ECL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
6.731 mm
Base Number Matches
2
1
I/O Type
SEPARATE
Screening Level
MIL-STD-883 Class B (Modified)
Compare 93L425ADC with alternatives
Compare AM10415AFMB with alternatives