93L422/BWAJC
vs
AM93L412ADCB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
ADVANCED MICRO DEVICES INC
Package Description
DIP, DIP22,.4
DIP, DIP22,.4
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-XDIP-T22
R-GDIP-T22
JESD-609 Code
e0
e0
Memory Density
1024 bit
1024 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Terminals
22
22
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Organization
256X4
256X4
Output Characteristics
3-STATE
OPEN-COLLECTOR
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP22,.4
DIP22,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Pbfree Code
Part Package Code
DIP
Pin Count
22
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
45 ns
Length
27.4955 mm
Number of Functions
1
Number of Ports
1
Output Enable
YES
Seated Height-Max
5.588 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Width
10.16 mm
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