93C76A-E/P
vs
93C66B-I/MNY
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
DFN
Package Description
0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8
HVSON,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
2 MHz
3 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
R-PDSO-N8
JESD-609 Code
e3
e4
Length
9.46 mm
3 mm
Memory Density
1024 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
16
Number of Functions
1
1
Number of Ports
1
Number of Terminals
8
8
Number of Words
128 words
256 words
Number of Words Code
128
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
256X16
Output Characteristics
TOTEM POLE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
HVSON
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Ready/Busy
YES
Reverse Pinout
NO
Screening Level
TS 16949
Seated Height-Max
4.32 mm
0.8 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Standby Current-Max
0.000001 A
Supply Current-Max
0.003 mA
0.002 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
4.5 V
Supply Voltage-Nom (Vsup)
2.5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
Width
7.62 mm
2 mm
Write Cycle Time-Max (tWC)
6 ms
2 ms
Write Protection
SOFTWARE
Base Number Matches
1
1
Compare 93C76A-E/P with alternatives
Compare 93C66B-I/MNY with alternatives