93C66C-TE/MSG vs M93C66-DS3/S feature comparison

93C66C-TE/MSG Microchip Technology Inc

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M93C66-DS3/S STMicroelectronics

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC STMICROELECTRONICS
Part Package Code TSSOP SOIC
Package Description LEAD FREE, PLASTIC, MO-187, MSOP-8 3 X 3 MM, TSSOP-8
Pin Count 8 8
Reach Compliance Code compliant not_compliant
Alternate Memory Width 8 8
Clock Frequency-Max (fCLK) 3 MHz 2 MHz
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e3 e0
Length 3 mm 3 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X16 256X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3 mm 3 mm
Write Cycle Time-Max (tWC) 2 ms 5 ms
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51

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