93C66C-TE/MSG vs 93C66B-TE/MS feature comparison

93C66C-TE/MSG Microchip Technology Inc

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93C66B-TE/MS Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code TSSOP TSSOP
Package Description LEAD FREE, PLASTIC, MO-187, MSOP-8 TSSOP,
Pin Count 8 8
Reach Compliance Code compliant compliant
Alternate Memory Width 8
Clock Frequency-Max (fCLK) 3 MHz 3 MHz
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e3 e3
Length 3 mm 3 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X16 256X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 3 mm 3 mm
Write Cycle Time-Max (tWC) 2 ms 2 ms
Base Number Matches 2 4

Compare 93C66C-TE/MSG with alternatives

Compare 93C66B-TE/MS with alternatives