93C66B-TI/MC
vs
M93C66-MB3/W
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Part Package Code
SON
SOIC
Package Description
HVSON,
2 X 3 MM, MLP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
Clock Frequency-Max (fCLK)
3 MHz
2 MHz
JESD-30 Code
R-PDSO-N8
R-XDSO-N8
JESD-609 Code
e3
e0
Length
3 mm
3 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256X16
256X16
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVSON
VSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
0.6 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
2 mm
2 mm
Write Cycle Time-Max (tWC)
2 ms
5 ms
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.32.00.51
Alternate Memory Width
8
Supply Current-Max
0.002 mA
Compare 93C66B-TI/MC with alternatives
Compare M93C66-MB3/W with alternatives