93C66AE/P vs SLE25C160-D feature comparison

93C66AE/P Microchip Technology Inc

Buy Now Datasheet

SLE25C160-D Siemens

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SIEMENS A G
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, DIP-8 ,
Pin Count 8
Reach Compliance Code compliant unknown
Additional Feature 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS SPI BUS INTERFACE; 32 BYTE PAGE MODE; 40 YEARS DATA RETENTION
Clock Frequency-Max (fCLK) 2 MHz 2.1 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3
Length 9.46 mm
Memory Density 4096 bit 16384 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 512 words 2048 words
Number of Words Code 512 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512X8 2KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm
Serial Bus Type MICROWIRE SPI
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Write Cycle Time-Max (tWC) 2 ms 8 ms
Base Number Matches 3 2
ECCN Code EAR99
HTS Code 8542.32.00.51
Data Retention Time-Min 40

Compare 93C66AE/P with alternatives

Compare SLE25C160-D with alternatives