93C56TI/SM
vs
93C56/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
SOP, SOP8,.3
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Alternate Memory Width
8
8
Clock Frequency-Max (fCLK)
2 MHz
2 MHz
Data Retention Time-Min
40
40
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e0
e0
Length
5.28 mm
9.9695 mm
Memory Density
2048 bit
2048 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128X16
128X16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.03 mm
4.064 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Standby Current-Max
0.0001 A
0.0001 A
Supply Current-Max
0.004 mA
0.004 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
5.2 mm
7.62 mm
Write Cycle Time-Max (tWC)
1 ms
1 ms
Write Protection
SOFTWARE
SOFTWARE
Base Number Matches
2
1
Compare 93C56TI/SM with alternatives
Compare 93C56/P with alternatives