93C06E/P vs KM93C06I feature comparison

93C06E/P Rochester Electronics LLC

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KM93C06I Samsung Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, DIP-8 DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown compliant
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Length 9.9695 mm 9.185 mm
Memory Density 256 bit 256 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16X16 16X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.064 mm 4.55 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 2 ms 30 ms
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS
Data Retention Time-Min 10
Endurance 100000 Write/Erase Cycles
Package Equivalence Code DIP8,.3
Standby Current-Max 0.0001 A
Supply Current-Max 0.003 mA
Write Protection SOFTWARE

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