93C06E/P
vs
KM93C06I
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, DIP-8
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
unknown
compliant
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e0
Length
9.9695 mm
9.185 mm
Memory Density
256 bit
256 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Moisture Sensitivity Level
NOT SPECIFIED
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16 words
16 words
Number of Words Code
16
16
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16X16
16X16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
4.064 mm
4.55 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
2 ms
30 ms
Base Number Matches
2
1
ECCN Code
EAR99
HTS Code
8542.32.00.51
Additional Feature
100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS
Data Retention Time-Min
10
Endurance
100000 Write/Erase Cycles
Package Equivalence Code
DIP8,.3
Standby Current-Max
0.0001 A
Supply Current-Max
0.003 mA
Write Protection
SOFTWARE
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