935386988472
vs
SLB9670VQ20FW785XUMA1
feature comparison
Part Life Cycle Code |
Not Recommended
|
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
Package Description |
,
|
|
Reach Compliance Code |
unknown
|
|
HTS Code |
8542.31.00.01
|
|
JESD-30 Code |
S-PQCC-N20
|
|
JESD-609 Code |
e4
|
|
Length |
3 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
20
|
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVQCCN
|
|
Package Equivalence Code |
LCC20,.12SQ,16
|
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
0.33 mm
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
1.62 V
|
|
Supply Voltage-Nom |
1.8 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.4 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
|
uPs/uCs/Peripheral ICs Type |
CRYPTOGRAPHIC AUTHENTICATOR
|
|
Base Number Matches |
1
|
|
|
|
|
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