935360463557
vs
MCIMX6S5DVM10ACR
feature comparison
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
MABGA-624
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
5A992.C
|
| Factory Lead Time |
|
13 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-30 Code |
|
S-PBGA-B624
|
| Length |
|
21 mm
|
| Number of Terminals |
|
624
|
| Operating Temperature-Max |
|
95 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA624,25X25,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Seated Height-Max |
|
1.6 mm
|
| Supply Voltage-Max |
|
1.5 V
|
| Supply Voltage-Min |
|
1.35 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
21 mm
|
|
|
|
Compare 935360463557 with alternatives
Compare MCIMX6S5DVM10ACR with alternatives