935358996128
vs
SC18IM700IPW
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-609 Code |
e4
|
|
| Moisture Sensitivity Level |
1
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, I2C
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| JESD-30 Code |
|
R-PDSO-G16
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
15 mA
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.635 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
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