935311117557
vs
MCIMX6S5EVM10AD
feature comparison
Part Life Cycle Code |
Not Recommended
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
MABGA-624
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.31.00.01
|
JESD-609 Code |
e1
|
e1
|
Moisture Sensitivity Level |
3
|
3
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
5A992.C
|
Factory Lead Time |
|
13 Weeks
|
Samacsys Manufacturer |
|
NXP
|
JESD-30 Code |
|
S-PBGA-B624
|
Length |
|
21 mm
|
Number of Terminals |
|
624
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
-20 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LFBGA
|
Package Equivalence Code |
|
BGA624,25X25,32
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
|
1.6 mm
|
Supply Voltage-Max |
|
1.5 V
|
Supply Voltage-Min |
|
1.35 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
21 mm
|
|
|
|
Compare 935311117557 with alternatives
Compare MCIMX6S5EVM10AD with alternatives