935309446557
vs
MC9S08AW60MFGER
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
,
,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
Address Bus Width
Bit Size
8
Boundary Scan
NO
Clock Frequency-Max
40 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-30 Code
S-PQFP-G44
JESD-609 Code
e3
e3
Length
10 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
54
Number of Terminals
44
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
LQFP
Package Equivalence Code
QFP44,.47SQ,32
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
RAM (bytes)
2048
ROM (words)
63280
ROM Programmability
FLASH
Seated Height-Max
1.6 mm
Speed
40 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
2.7 V
Supply Voltage-Nom
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
TIN
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.8 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
1
2
Rohs Code
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