935296091012
vs
NTS0104UK,012
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
VFBGA,
|
1.20 X 1.60 MM, 0.56 MM HEIGHT, WLCSP-12
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
R-PBGA-B12
|
R-PBGA-B12
|
Length |
1.6 mm
|
1.6 mm
|
Number of Functions |
4
|
4
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Seated Height-Max |
0.615 mm
|
0.615 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
1.2 mm
|
1.2 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
CSP
|
Pin Count |
|
12
|
Manufacturer Package Code |
|
OL-NTS0104UK
|
Samacsys Manufacturer |
|
NXP
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 935296091012 with alternatives
Compare NTS0104UK,012 with alternatives