935288883115 vs MAX3050ASA+ feature comparison

935288883115 NXP Semiconductors

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MAX3050ASA+ Maxim Integrated Products

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MAXIM INTEGRATED PRODUCTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e3
Length 4.9 mm 4.9 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 4
ECCN Code EAR99
Technology BICMOS

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