935284751125 vs 74LVCH1T45GW,125 feature comparison

935284751125 NXP Semiconductors

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74LVCH1T45GW,125 Nexperia

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Package Description TSSOP, PLASTIC, SC-88, SOT-363, 6 PIN
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Length 2 mm 2 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 23.5 ns 23.5 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Rohs Code Yes
Part Package Code TSSOP
Pin Count 6
Manufacturer Package Code SOT363-2
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Moisture Sensitivity Level 1
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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