935283234551 vs LPC1778FBD144 feature comparison

935283234551 NXP Semiconductors

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LPC1778FBD144 NXP Semiconductors

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Part Life Cycle Code Not Recommended Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TFBGA, 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 24 16
Bit Size 32 32
Clock Frequency-Max 25 MHz 25 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width 32 8
JESD-30 Code S-PBGA-B208 S-PQFP-G144
JESD-609 Code e1 e3
Length 15 mm 20 mm
Number of I/O Lines 160 119
Number of Terminals 208 144
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFQFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm 1.6 mm
Speed 72 MHz 120 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM QUAD
Width 15 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Rohs Code Yes
Part Package Code QFP
Pin Count 144
Factory Lead Time 2 Days
Samacsys Manufacturer NXP
Moisture Sensitivity Level 2
On Chip Program ROM Width 8
Package Equivalence Code QFP144,.87SQ,20
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 98304
ROM (words) 524288
Supply Current-Max 100 mA
Time@Peak Reflow Temperature-Max (s) 30

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