935280309128
vs
935270019518
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
HVQCCN,
|
QCCJ,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 2.5V SUPPLY
|
ALSO OPERATES AT 2.5V OR 5V SUPPLY
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
80 MHz
|
80 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ETHERNET
|
| Data Transfer Rate-Max |
5 MBps
|
0.625 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-N32
|
S-PQCC-J44
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
16.585 mm
|
| Low Power Mode |
NO
|
YES
|
| Number of Serial I/Os |
2
|
2
|
| Number of Terminals |
32
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Seated Height-Max |
1 mm
|
4.57 mm
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
16.585 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
LPCC
|
| Pin Count |
|
44
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare 935280309128 with alternatives
Compare 935270019518 with alternatives