935279993125
vs
74AUP1G07GM-G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
TSSOP,
VSON,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
R-PDSO-G6
R-PDSO-N6
JESD-609 Code
e3
e3
Length
2 mm
1.45 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VSON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR, 7 INCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
20.8 ns
20.7 ns
Seated Height-Max
1.1 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN
TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.25 mm
1 mm
Base Number Matches
2
1
Part Package Code
SON
Pin Count
6
Output Characteristics
OPEN-DRAIN
Qualification Status
Not Qualified
Compare 935279993125 with alternatives
Compare 74AUP1G07GM-G with alternatives