935272338118
vs
TS88915TVWB/T70
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
THOMSON-CSF COMPSANTS SPECIFIC
|
| Part Package Code |
BGA
|
|
| Package Description |
VFBGA,
|
QCCJ, LDCC28,.5SQ
|
| Pin Count |
56
|
|
| Manufacturer Package Code |
SOT-702-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Conditioning |
DIFFERENTIAL
|
|
| JESD-30 Code |
R-PBGA-B56
|
S-XQCC-J28
|
| Length |
7 mm
|
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
|
| Number of Functions |
1
|
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
56
|
28
|
| Number of True Outputs |
10
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
VFBGA
|
QCCJ
|
| Package Equivalence Code |
BGA56,6X10,25
|
LDCC28,.5SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.075 ns
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
J BEND
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.5 mm
|
|
| fmax-Min |
190 MHz
|
|
| Base Number Matches |
1
|
3
|
| JESD-609 Code |
|
e0
|
| Max I(ol) |
|
0.036 A
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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