935272021125
vs
74HCT1G08GV
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
TSSOP,
PLASTIC, SC-74A, 5 PIN
Pin Count
5
5
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
e3
Length
2.9 mm
2.9 mm
Logic IC Type
AND GATE
AND GATE
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Propagation Delay (tpd)
27 ns
27 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.95 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
1.5 mm
1.5 mm
Base Number Matches
2
2
Load Capacitance (CL)
50 pF
Max I(ol)
0.002 A
Package Equivalence Code
TSOP5/6,.11,37
Packing Method
TR
Prop. Delay@Nom-Sup
27 ns
Schmitt Trigger
NO
Compare 935272021125 with alternatives
Compare 74HCT1G08GV with alternatives