935272013125 vs SN74LVC1G32MDBVREP feature comparison

935272013125 NXP Semiconductors

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SN74LVC1G32MDBVREP Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SC-74A SOT-23
Package Description PLASTIC, SOT-753, SC-74A, 5 PIN LSSOP, TSOP5/6,.11,37
Pin Count 5 5
Manufacturer Package Code SOT753
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e4
Length 2.9 mm 2.9 mm
Logic IC Type OR GATE OR GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 10.5 ns 8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.5 mm 1.6 mm
Base Number Matches 2 1
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Load Capacitance (CL) 50 pF
Max I(ol) 0.032 A
Package Equivalence Code TSOP5/6,.11,37
Packing Method TR
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 5.7 ns
Schmitt Trigger NO

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Compare SN74LVC1G32MDBVREP with alternatives