935271933118
vs
74LVT16374AEV,118
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
BGA
BGA
Package Description
4.50 X 7 MM, 0.65 MM PITCH, PLASTIC, MO-225, SOT-702-1, VFBGA-56
VFBGA, BGA56,6X10,25
Pin Count
56
56
Manufacturer Package Code
SOT-702-1
SOT702-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVT
LVT
JESD-30 Code
R-PBGA-B56
R-PBGA-B56
Length
7 mm
7 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
1
8
Number of Functions
16
2
Number of Ports
2
2
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA56,6X10,25
BGA56,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
5.6 ns
5.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4.5 mm
4.5 mm
Base Number Matches
1
1
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
150000000 Hz
Max I(ol)
0.064 A
Moisture Sensitivity Level
2
Packing Method
TR
Prop. Delay@Nom-Sup
5 ns
Trigger Type
POSITIVE EDGE
Compare 935271933118 with alternatives
Compare 74LVT16374AEV,118 with alternatives