Findchips: Compare 935270079125 vs 74LVC1G17GW-Q100,125

935270079125 vs 74LVC1G17GW-Q100,125 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Active
Ihs Manufacturer	NEXPERIA	NEXPERIA
Package Description	TSSOP,	TSSOP-5
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3	e3
Length	2.05 mm	2.05 mm
Logic IC Type	BUFFER	BUFFER
Moisture Sensitivity Level	1	1
Number of Functions	1	1
Number of Inputs	1	1
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR, 7 INCH
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	14 ns	14 ns
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	TIN	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1.25 mm	1.25 mm
Base Number Matches	2	2
ECCN Code		EAR99
Screening Level		AEC-Q100
	Logic » Gates	Logic » Gates