935268381115
vs
74LVC1G32GW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
PHILIPS SEMICONDUCTORS
Package Description
TSSOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
Length
2.05 mm
Logic IC Type
OR GATE
OR GATE
Number of Functions
1
Number of Inputs
2
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
10.5 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e3
Package Equivalence Code
TSSOP5/6,.08
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Schmitt Trigger
NO
Terminal Finish
MATTE TIN
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