935267636112 vs SSTL16857DGG,112 feature comparison

935267636112 NXP Semiconductors

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SSTL16857DGG,112 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description 6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP1-48 PLASTIC, TSSOP-48
Pin Count 48 48
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTL SSTL
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e4
Length 12.5 mm 12.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 14 14
Number of Functions 1 1
Number of Terminals 48 48
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 3.5 ns 3.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.7 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 6.1 mm 6.1 mm
fmax-Min 200 MHz 200 MHz
Base Number Matches 1 1
Moisture Sensitivity Level 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare SSTL16857DGG,112 with alternatives