935262202112
vs
AN5512
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PANASONIC CORP
|
Part Package Code |
SIP
|
SFM
|
Package Description |
SIP,
|
SIP-9
|
Pin Count |
9
|
9
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Blanking Output |
NO
|
NO
|
Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
JESD-30 Code |
R-PSIP-T9
|
R-PSFM-T9
|
Length |
23.8 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
75 °C
|
70 °C
|
Operating Temperature-Min |
-25 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SIP
|
SIP
|
Package Equivalence Code |
SIP9,.1
|
SIP9,.1
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
14.2 mm
|
|
Supply Voltage-Max (Vsup) |
25 V
|
|
Supply Voltage-Min (Vsup) |
9 V
|
|
Surface Mount |
NO
|
NO
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
4.4 mm
|
|
Base Number Matches |
1
|
1
|
Application |
|
TV
|
JESD-609 Code |
|
e0
|
Technology |
|
BIPOLAR
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 935262202112 with alternatives
Compare AN5512 with alternatives