935245610118 vs 74HC1G00GW feature comparison

935245610118 Nexperia

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74HC1G00GW NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description TSSOP, PLASTIC, SC-88A, 5 PIN
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2.05 mm 2 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 135 ns 135 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 5
ECCN Code EAR99
Samacsys Manufacturer NXP
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.002 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

Compare 935245610118 with alternatives

Compare 74HC1G00GW with alternatives