935245610115
vs
MC74HC1G00DFT1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ON SEMICONDUCTOR
Part Package Code
SOIC
SOT-353
Package Description
TSSOP,
TSSOP, TSSOP5/6,.08
Pin Count
5
5
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
Length
2 mm
2 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
135 ns
155 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
2
4
Rohs Code
ECCN Code
EAR99
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.002 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP5/6,.08
Packing Method
TR
Peak Reflow Temperature (Cel)
235
Prop. Delay@Nom-Sup
35 ns
Schmitt Trigger
NO
Terminal Finish
TIN LEAD
Compare 935245610115 with alternatives
Compare MC74HC1G00DFT1 with alternatives