935234730112
vs
TDF8554J/N4
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
ZIP
|
SOT
|
| Package Description |
POWER, PLASTIC, SOT-411-1, DIL-BENT-SIL, 23 PIN
|
PLASTIC, SOT725-1, 37 PIN
|
| Pin Count |
23
|
37
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
20 kHz
|
22 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
26 dB
|
|
| Harmonic Distortion |
30%
|
10%
|
| JESD-30 Code |
R-PZIP-T23
|
R-PZFM-T37
|
| Length |
30.15 mm
|
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
23
|
37
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
35 W
|
44 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
ZIP
|
ZIP
|
| Package Equivalence Code |
ZIP23,.2,.17
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
16.9 mm
|
|
| Supply Current-Max |
360 mA
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
6 V
|
6 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
ZIG-ZAG
|
ZIG-ZAG
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4.45 mm
|
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
SOT725-1
|
| Technology |
|
BCDMOS
|
|
|
|
Compare 935234730112 with alternatives
Compare TDF8554J/N4 with alternatives