935230100112
vs
HD74LV132ATELL-E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Not Recommended
Ihs Manufacturer
NXP SEMICONDUCTORS
RENESAS ELECTRONICS CORP
Part Package Code
TSSOP
TSSOP
Package Description
4.40 MM, PLASTIC, SOT-402-1, MO-153, TSSOP-14
TSSOP, TSSOP14,.25
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
5 mm
5 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
43 ns
23 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4.4 mm
4.4 mm
Base Number Matches
2
1
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP14,.25
Packing Method
TR
Prop. Delay@Nom-Sup
17.5 ns
Schmitt Trigger
YES
Terminal Finish
NICKEL PALLADIUM GOLD
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Compare HD74LV132ATELL-E with alternatives