935208760112
vs
M38510/30101BBA
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SRI INTERNATIONAL
|
Part Package Code |
TSSOP
|
DFP
|
Package Description |
TSSOP,
|
DFP, FL14,.3
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
ABT
|
LS
|
JESD-30 Code |
R-PDSO-G14
|
R-GDFP-F14
|
JESD-609 Code |
e4
|
e0
|
Length |
5 mm
|
|
Logic IC Type |
D FLIP-FLOP
|
J-K FLIP-FLOP
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
TSSOP
|
DFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Propagation Delay (tpd) |
4 ns
|
42 ns
|
Qualification Status |
Not Qualified
|
Qualified
|
Seated Height-Max |
1.1 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
TTL
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Trigger Type |
POSITIVE EDGE
|
NEGATIVE EDGE
|
Width |
4.4 mm
|
|
fmax-Min |
150 MHz
|
25 MHz
|
Base Number Matches |
2
|
1
|
Max Frequency@Nom-Sup |
|
25000000 Hz
|
Max I(ol) |
|
0.004 A
|
Package Equivalence Code |
|
FL14,.3
|
Power Supply Current-Max (ICC) |
|
8 mA
|
Screening Level |
|
MIL-PRF-38535 Class B
|
|
|
|
Compare 935208760112 with alternatives
Compare M38510/30101BBA with alternatives