935208760112 vs TC74HC73AF(EL) feature comparison

935208760112 NXP Semiconductors

Buy Now Datasheet

TC74HC73AF(EL) Toshiba America Electronic Components

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code TSSOP SOIC
Package Description TSSOP, 0.300 INCH, PLASTIC, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family ABT HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 5 mm 10.3 mm
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 1 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Propagation Delay (tpd) 4 ns 31 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Width 4.4 mm 5.3 mm
fmax-Min 150 MHz 24 MHz
Base Number Matches 1 2
Additional Feature MASTER SLAVE OPERATION
Load Capacitance (CL) 50 pF

Compare 935208760112 with alternatives

Compare TC74HC73AF(EL) with alternatives