935207080112 vs 74ABT08DB,118 feature comparison

935207080112 NXP Semiconductors

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74ABT08DB,118 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP SSOP1
Package Description SSOP, PLASTIC, SSOP2-14
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family ABT ABT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 4 ns 3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 2
Manufacturer Package Code SOT337-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.02 A
Package Equivalence Code SSOP14,.3
Packing Method TR
Power Supply Current-Max (ICC) 0.05 mA
Prop. Delay@Nom-Sup 4 ns
Schmitt Trigger NO

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Compare 74ABT08DB,118 with alternatives