935191500005
vs
935302719118
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIE
|
|
Package Description |
DIE,
|
SOP,
|
Pin Count |
8
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XUUC-N8
|
R-PDSO-G8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
Length |
|
4.9 mm
|
Moisture Sensitivity Level |
|
1
|
Screening Level |
|
AEC-Q100
|
Seated Height-Max |
|
1.75 mm
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
3.9 mm
|
|
|
|
Compare 935191500005 with alternatives
Compare 935302719118 with alternatives