935189160112 vs GD74HCT688J feature comparison

935189160112 NXP Semiconductors

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GD74HCT688J Goldstar Electron Co Ltd

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS GOLDSTAR ELECTRON CO LTD
Part Package Code TSSOP
Package Description TSSOP, ,
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-CDIP-T20
JESD-609 Code e4
Length 6.5 mm
Logic IC Type IDENTITY COMPARATOR IDENTITY COMPARATOR
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 51 ns 42 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm
Base Number Matches 1 2
Additional Feature CASCADABLE
Load Capacitance (CL) 50 pF

Compare 935189160112 with alternatives

Compare GD74HCT688J with alternatives