935188970112
vs
CD54HCT175H/3A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NEXPERIA
HARRIS SEMICONDUCTOR
Package Description
TSSOP,
DIE,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDSO-G16
X-XUUC-N16
JESD-609 Code
e4
Length
5 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
50 ns
50 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
4.4 mm
fmax-Min
17 MHz
25 MHz
Base Number Matches
2
2
Package Equivalence Code
DIE OR CHIP
Compare 935188970112 with alternatives
Compare CD54HCT175H/3A with alternatives