935188400118
vs
MC74HC157AD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NEXPERIA
MOTOROLA INC
Package Description
TSSOP,
SOP, SOP16,.25
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e0
Length
5 mm
9.9 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TR, 13 INCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
45 ns
33 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
3.9 mm
Base Number Matches
2
4
Part Package Code
SOIC
Pin Count
16
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Package Equivalence Code
SOP16,.25
Prop. Delay@Nom-Sup
32 ns
Compare 935188400118 with alternatives
Compare MC74HC157AD with alternatives