935186140112 vs HD74LS374P feature comparison

935186140112 NXP Semiconductors

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HD74LS374P Hitachi Ltd

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS HITACHI LTD
Part Package Code SSOP DIP
Package Description SSOP, DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST LS
JESD-30 Code R-PDSO-G20 R-PDIP-T20
JESD-609 Code e4
Length 7.2 mm 24.5 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 1 8
Number of Functions 8 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -20 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 8.5 ns 28 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 7.62 mm
Base Number Matches 1 1
Max I(ol) 0.024 A
Package Equivalence Code DIP20,.3
Power Supply Current-Max (ICC) 40 mA
Prop. Delay@Nom-Sup 28 ns
Trigger Type POSITIVE EDGE

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Compare HD74LS374P with alternatives