935054410112
vs
TDA7052AT/N2,118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
DIP,
3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.33.00.01
Consumer IC Type
VOLUME CONTROL CIRCUIT
VOLUME CONTROL CIRCUIT
Harmonic Distortion
0.3%
0.3%
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e4
e4
Length
9.5 mm
4.9 mm
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
1.75 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Surface Mount
NO
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
7.62 mm
3.9 mm
Base Number Matches
1
1
Manufacturer Package Code
SOT96-1
Samacsys Manufacturer
NXP
Moisture Sensitivity Level
1
Supply Current-Max
12 mA
Technology
BIPOLAR
Compare 935054410112 with alternatives
Compare TDA7052AT/N2,118 with alternatives