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934060922112 vs BLF6G20LS-75,112 feature comparison

934060922112 NXP Semiconductors

Buy Now Datasheet

BLF6G20LS-75,112 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description FLATPACK, R-CDFP-F2 ROHS COMPLIANT, CERAMIC PACKAGE-3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Case Connection SOURCE SOURCE
Configuration SINGLE SINGLE
DS Breakdown Voltage-Min 65 V 65 V
Drain Current-Max (ID) 18 A 18 A
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band L BAND L BAND
JESD-30 Code R-CDFP-F2 R-CDFP-F2
Number of Elements 1 1
Number of Terminals 2 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Polarity/Channel Type N-CHANNEL N-CHANNEL
Surface Mount YES YES
Terminal Form FLAT FLAT
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Rohs Code Yes
Part Package Code SOT
Pin Count 2
Manufacturer Package Code SOT502B
HTS Code 8541.29.00.75
Operating Temperature-Max 225 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistors » RF Power Field-Effect Transistors
Transistors » RF Power Field-Effect Transistors

Compare 934060922112 with alternatives

Compare BLF6G20LS-75,112 with alternatives