934059366115
vs
BZV55-C10,115
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.4 W
Reference Standard
IEC-60134
Reference Voltage-Nom
10 V
10 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
1
2
Rohs Code
Part Package Code
MELF
Pin Count
2
Manufacturer Package Code
SOD80C
Dynamic Impedance-Max
20 Ω
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Reverse Current-Max
0.2 µA
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
8 mV/°C
Compare 934059366115 with alternatives
Compare BZV55-C10,115 with alternatives